Ohmalloy Material Co.,Ltd
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0.2mm thick C19400 foil for semiconductor chip lead frame
The remarkable characteristics of the material are: high strength, high conductivity, high precision and high softening temperature resistance, as well as suitable processing properties and electroplating brazing properties.
It is mainly used for the production of semiconductor chip lead frame, integrated circuit and electronic discrete devices, electronic industry connectors, etc.
Standard:
| GB/T | DIN | EN | ASTM | JIS |
| QFe2.5 | CuFe2P 2.1310 | CuFe2P CW107C | C19400 | C19400 |
Chemical composition:
| Cu | Bal. |
| Fe | 2.1-2.6 |
| Zn | 0.05-0.2 |
| P | 0.015-0.15 |
Physical property:
| Density(g/cm3) | 8.9 |
| Conductivity IACS% {(20℃)} | 60min |
| Modulus of elasticity(KN/mm2) | 121 |
| Thermal conductivity {W/(m*K)} | 280 |
| Coefficient of thermal expansion (10-6/℃ 20/℃ ~100/℃) | 17.7 |
| Status | Tensile strength | Yield strength | Elongation A50 | Hardness | Bending test | |
| 90°(R/T) | ||||||
| (Rm,MPa) | (Rp0.2,MPa) | (%) | (HV) | GW | BW | |
| R300 | 300-340 | 240max | 20min | 80-100 | 0 | 0 |
| R340 | 340-390 | 240min | 10min | 100-120 | 0 | 0 |
| R370 | 370-430 | 330min | 6min | 120-140 | 0 | 0 |
| R420 | 420-480 | 380min | 3min | 130-150 | 0.5 | 0.5 |
| R470 | 470-530 | 440min | 4min | 140-160 | 0.5 | 0.5 |
| R530 | 530-570 | 470min | 5min | 150-170 | 1 | 1 |
Package